JPH051985B2 - - Google Patents
Info
- Publication number
- JPH051985B2 JPH051985B2 JP62022475A JP2247587A JPH051985B2 JP H051985 B2 JPH051985 B2 JP H051985B2 JP 62022475 A JP62022475 A JP 62022475A JP 2247587 A JP2247587 A JP 2247587A JP H051985 B2 JPH051985 B2 JP H051985B2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- superconducting line
- etching
- auxiliary layer
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62022475A JPS63192283A (ja) | 1987-02-04 | 1987-02-04 | 超伝導線路の形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62022475A JPS63192283A (ja) | 1987-02-04 | 1987-02-04 | 超伝導線路の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63192283A JPS63192283A (ja) | 1988-08-09 |
JPH051985B2 true JPH051985B2 (en]) | 1993-01-11 |
Family
ID=12083745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62022475A Granted JPS63192283A (ja) | 1987-02-04 | 1987-02-04 | 超伝導線路の形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63192283A (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6045011B1 (ja) | 2016-04-30 | 2016-12-14 | 洪 瑟芬 | バッグインボックス |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6146081A (ja) * | 1984-08-10 | 1986-03-06 | Nec Corp | ジヨセフソン接合素子の製造方法 |
JPS61244078A (ja) * | 1985-04-22 | 1986-10-30 | Agency Of Ind Science & Technol | 超伝導線路の作製方法 |
-
1987
- 1987-02-04 JP JP62022475A patent/JPS63192283A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63192283A (ja) | 1988-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |